MediaTek simply revealed the Dimensity 8400 mobile cpu. Following a recent pattern in flagship SoCs, the brand-new chip is powered just by high-performance cores, without the smaller sized efficiency cores. Outside the CPU, the new chip also brings front runner attributes to gaming, photography, and, certainly, artificial intelligence.
After pioneering an all “large core” design processor in 2023 and duplicating the method with the Dimensity 9400 this year, MediaTek increased (tripled?) down on the strategy with the brand-new mid-range chip: The Dimensity 8400 The brand-new chip guarantees even more efficiency for daily jobs, with an estimated 41 % uplift in multi-core CPU performance.
| MediaTek Dimensity 8400 | Qualcomm Snapdragon 7 + Gen 3 | Samsung Exynos 1480 | MediaTek Dimensity 8300 | Qualcomm Snapdragon 7 + Gen 2 | |
|---|---|---|---|---|---|
| Prime core | 1 x Cortex-A 725 @ 3 25 GHz | 1 x Cortex-X 4 @ 2 6 GHz | 1 × Cortex-A 715 @ 3 35 GHz | 1 x Cortex-X 2 @ 2 91 GHz | |
| Performance core | 3 x Cortex-A 725 | 4 x Cortex A 720 @ 2 6 GHz | 4 x Cortex A 78 @ 2 75 GHz | 3 × Cortex-A 715 @ 3 2 GHz | 3 x Cortex A 710 @ 2 49 GHz |
| Effectiveness core | 4 x Cortex-A 725 | 3 x Cortex-A 520 @ 1 9 GHz | 4 x Cortex-A 55 @ 2 GHz | 4 × Cortex-A 510 @ 2 2 GHz | 4 x Cortex-A 510 @ 1 8 GHz |
| RAM | LPDDR 5 x- 8533 4 x 16 -bit @ 4266 MHz (68 2 4 GB/s) |
LPDDR 5 x- 8400 4 x 16 -bit @ 4200 MHz (67 2 GB/s) |
LPDDR 5 – 6400 2 x 16 -little bit @ 3200 MHz (25 6 GB/s) |
LPDDR 5 x- 8533 4 x 16 -bit @ 4266 MHz (68 2 4 GB/s) |
LPDDR 5 – 6400 4 x 16 -little bit @ 3200 MHz (51 2 GB/s) |
| GPU | 7 x ARM Mali-G 720 (2329 6 GFLOPS) |
Adreno 732 (1459 GFLOPS) |
AMD RDNA 3 (332 GFLOPS) |
6 x ARM Mali-G 615 (2150 4 GFLOPS) |
Adreno 725 (1188 GFLOPS) |
| 5 G modem | MediaTek (5 17 Gbps) |
Snapdragon X 63 (5/ 3 5 Gbps) |
Exynos 5328 (5/ 1 28 Gbps) |
MediaTek (5 17 Gbps) |
Snapdragon X 62 (4 4/ 1 6 Gbps) |
| Connectivity | Wi-Fi 6 E Bluetooth 5 4 |
Wi-Fi 7 Bluetooth 5 4 |
Wi-Fi 6 E Bluetooth 5 3 |
Wi-Fi 6 E Bluetooth 5 4 |
Wi-Fi 6 E Bluetooth 5 3 |
| Refine node | TSMC N 4 P | TSMC N 4 P | Samsung 4 LPP | TSMC N 4 P | TSMC N 4 |
Instead of utilizing the smaller sized (and slower) effectiveness CPU cores, MediaTek developed the Dimensity 8400 with an all “huge core” design. The chip includes eight ARM Cortex-A 725 at as much as 3 25 GHz. Those A 725 cores are split right into three tiers, with various amounts of L 2 cache memory: 1 core with 1 MEGABYTES, 3 cores with 512 KB, and 4 cores with 256 KB.
To feed those cores, the Dimensity 8400 supports the latest LPDDR 5 x- 8533 RAM standard, while storage duties are managed by the latest-generation UFS 4 requirement.
For graphics rendering, the Dimensity 8400 loads 7 ARM Mali-G 720 GPU cores. MediaTek promotes 24 % much better efficiency and 42 % better power effectiveness compared to the previous generation Dimensity 8300 chip. While the GPU does not sustain ray tracing, the Taiwanese company promises smooth rasterization efficiency.
In real 2024 style, the new MediaTek mid-ranger supports significant AI applications thanks to its NPU, with assured support for agentic applications. Various other cores on the Dimensity 8400 trickle-down functions located on the flagship 9000 series, such as improved handling for picture capture, dynamic 5 G/Wi-Fi changing, and more.
According to MediaTek, the new Dimensity 8400 should concern market soon, with the initial phones promised “by [the] end of2024 It will certainly be interesting to see whether Qualcomm will take on a similar “large core” style for its Snapdragon 7 chips.